2025 | Connecting the Corridor: Where AI meets Silicon

2025 | Connecting the Corridor: Where AI meets Silicon

Join us for a full day of panels focused on innovation and AI!

1155 Avenue of the Americas, 41st Floor, New York, NY 10036

December 9, 2025

AM

8:30 am Check-in
9:00 am Welcoming remarks
9:10 am Keynote address
Presented by Dr Mukesh V. Kare - General Manager: IBM Semiconductors & Vice President: Hybrid Cloud
9:35 am Hardware: Innovation in integrated circuit design driving advancements in AI
Explore how recent innovations in integrated circuit (IC) design are powering the next generation of artificial intelligence. Semiconductor leaders will discuss how new architectures and hardware breakthroughs are accelerating model training, improving energy efficiency, and enabling increasingly powerful AI applications.
10:20 am Smarter fabs: AI at work inside the fab
As semiconductors power the AI revolution, AI itself is redefining how chips are made. This discussion will explore how artificial intelligence inside the fab is unlocking new levels of efficiency, agility, and innovation – from predictive analytics to digital twins that mirror and optimize real-time operations – paving the way for the self-optimizing factories of the future.
11:00 am Coffee break
11:20 am NSMC overview
Discover success stories and what’s ahead for the corridor.
Noon Lunch and networking

PM

1:15 pm Advanced packaging driving AI efficiency
Advances in semiconductor packaging are playing a critical role in AI performance and efficiency. This panel will showcase the latest developments in advanced packaging (3D integration, chiplets, heterogeneous approaches) and their impact on reducing power consumption, boosting compute density, and strengthening the region’s competitiveness.
2:05 pm Integrated circuit design from defense industry perspective
The defense sector is at the forefront of critical technologies. This panel will examine IC design through the lens of defense priorities, cybersecurity, and technological sovereignty. Experts will share how defense-driven approaches can inspire civilian applications and reinforce the resilience of semiconductor supply chains.
2:45 pm Coffee break
3:05 pm Workforce development
The future of microelectronics and AI depends on the ability to train, attract, and retain top talent. This session will spotlight workforce development initiatives, academic–industry collaborations, and inclusion strategies to prepare the next generation of professionals. Panelists will also discuss cross-border talent mobility between Canada and the United States as a key driver of the Northeast Corridor ecosystem.
4 pm - 6:30 pm Networking session

Keynote address

Dr. Mukesh V. Khare is General Manager of IBM Semiconductors division and Vice President of Hybrid Cloud research at IBM Research. He leads a global team of more than 1500 researchers and engineers that are re-defining the future of computing for next generation workloads such as generative artificial intelligence (AI), high-performance computing, and their delivery via hybrid multi cloud. His research agenda includes semiconductor process technology, chip design for accelerated computing, system architecture and hybrid cloud software. Throughout his career, Dr. Khare has built and driven collaborative research alliances that lead to breakthrough advances in computing, such as 7nm and 2nm chip technologies.

Hardware: Innovation in integrated circuit design driving advancements in AI

This panel will explore how recent innovations in chips design are powering the next generation of artificial intelligence. Semiconductor leaders will discuss how new architectures and hardware breakthroughs are accelerating model training, improving energy efficiency, and enabling increasingly powerful AI applications.

Smarter fabs: AI at work inside the fab

As semiconductors power the AI revolution, AI itself is redefining how chips are made. This discussion will explore how artificial intelligence inside the fab is unlocking new levels of efficiency, agility, and innovation – from predictive analytics to digital twins that mirror and optimize real-time operations – paving the way for the self-optimizing factories of the future.

Advanced packaging driving AI efficiency

Advances in semiconductor packaging are playing a critical role in AI performance and efficiency. This panel will showcase the latest developments in advanced packaging (3D integration, chiplets, heterogeneous approaches) and their impact on reducing power consumption, boosting compute density, and strengthening the region’s competitiveness.

Integrated circuit design from defense industry perspective

The defense sector is at the forefront of critical technologies. This panel will examine IC design through the lens of defense priorities, cybersecurity, and technological sovereignty. Experts will share how defense-driven approaches can inspire civilian applications and reinforce the resilience of semiconductor supply chains.

Workforce development

The future of microelectronics and AI depends on the ability to train, attract, and retain top talent. This session will spotlight workforce development initiatives, academic–industry collaborations, and inclusion strategies to prepare the next generation of professionals. Panelists will also discuss cross-border talent mobility between Canada and the United States as a key driver of the Northeast Corridor ecosystem.

Reserve your spot now

Reserve your spot now

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